Laser Cutting Machine-YSV-7A/6A (Double Platform)
1. Laser cutting machine YSV-4A, double platform, greatly improve production efficiency, is specially designed for FPC and PCB processing equipment.
2. High-performance lasers: Solid-state ultraviolet lasers with international first-line brands have the advantages of good beam quality, small focus spot, uniform power distribution, small thermal effect, small slit width and high cutting quality, which are the guarantee of perfect cutting quality.
2. efficient and fast FPC/PCB surface cutting, drilling and covering film fenestration, fingerprint identification chip cutting, TF memory card sub board, mobile phone camera module cutting and other applications.
3. Full automatic positioning: High-precision CCD automatic positioning, focusing, so that positioning fast, accurate and high accuracy, without manual intervention.
4. Simple operation, realizing the same type of one-key mode, greatly improving production efficiency.
5. Cut into blocks, layers, designated blocks or selected areas and shape directly. Cut edges are smooth, smooth, without burrs and glue spills.
6. The product can be arranged in matrix for automatic positioning and cutting, especially for fine, difficult, complex patterns and other shape cutting.
7. Exhaust gas treatment system: The suction system can eliminate all cutting exhaust gas, avoiding the harm to operators and pollution to the environment.
Technical parameters of the project:
(1) The weight of laser machine is 2000KG.
Laser power 10W/15W (ultraviolet)
(3) Accuracy of the whole machine (+20 micron)
(4) Main body size (length * width * height) 1680mm * 1650mm * 1800mm
Cutting width 350mm * 400mm / 350mm * 400mm (double platform)
_Laser power supply AC220V/3.5KW
Laser source ultraviolet laser
The width of the slit is 20 +5 um
_Platform positioning accuracy (+2 micron)
_Platform repetition accuracy (+2 um) material thickness (<1.5 mm) depending on the actual material
_Scanning speed 1-900 mm/ms
Laser Cutting Machine-YSV-7A/6A (Double Platform)
1. Laser cutting machine YSV-4A, double platform, greatly improve production efficiency, is specially designed for FPC and PCB processing equipment.
2. High-performance lasers: Solid-state ultraviolet lasers with international first-line brands have the advantages of good beam quality, small focus spot, uniform power distribution, small thermal effect, small slit width and high cutting quality, which are the guarantee of perfect cutting quality.
2. efficient and fast FPC/PCB surface cutting, drilling and covering film fenestration, fingerprint identification chip cutting, TF memory card sub board, mobile phone camera module cutting and other applications.
3. Full automatic positioning: High-precision CCD automatic positioning, focusing, so that positioning fast, accurate and high accuracy, without manual intervention.
4. Simple operation, realizing the same type of one-key mode, greatly improving production efficiency.
5. Cut into blocks, layers, designated blocks or selected areas and shape directly. Cut edges are smooth, smooth, without burrs and glue spills.
6. The product can be arranged in matrix for automatic positioning and cutting, especially for fine, difficult, complex patterns and other shape cutting.
7. Exhaust gas treatment system: The suction system can eliminate all cutting exhaust gas, avoiding the harm to operators and pollution to the environment.
Technical parameters of the project:
(1) The weight of laser machine is 2000KG.
Laser power 10W/15W (ultraviolet)
(3) Accuracy of the whole machine (+20 micron)
(4) Main body size (length * width * height) 1680mm * 1650mm * 1800mm
Cutting width 350mm * 400mm / 350mm * 400mm (double platform)
_Laser power supply AC220V/3.5KW
Laser source ultraviolet laser
The width of the slit is 20 +5 um
_Platform positioning accuracy (+2 micron)
_Platform repetition accuracy (+2 um) material thickness (<1.5 mm) depending on the actual material
_Scanning speed 1-900 mm/ms
