Laser Cutting Machine-YSV-7A/6A (Double Platform)

特点：

Characteristic:

1. 激光切割机YSV-4A，双平台，大幅提高生产效率，是专为FPC和PCB加工量身打造的设备。

1. Laser cutting machine YSV-4A, double platform, greatly improve production efficiency, is specially designed for FPC and PCB processing equipment.

2.高性能激光器: 采用国际一线品牌的固态紫外激光器，具有光束质量好、聚焦光斑小、功率分布均匀、热效应小、切缝宽度小、切割质量高等优点是完美切割品质的保证。

2. High-performance lasers: Solid-state ultraviolet lasers with international first-line brands have the advantages of good beam quality, small focus spot, uniform power distribution, small thermal effect, small slit width and high cutting quality, which are the guarantee of perfect cutting quality.

2. 高效、快速的FPC/PCB外型切割、钻孔及覆盖膜开窗、指纹识别芯片切割、TF内存卡分板、手机摄像头模组切割等应用。

2. efficient and fast FPC/PCB surface cutting, drilling and covering film fenestration, fingerprint identification chip cutting, TF memory card sub board, mobile phone camera module cutting and other applications.

3.完全自动定位：采用高精度CCD自动定位、对焦，使定位快速准确精度高，无需人工干预。

3. Full automatic positioning: High-precision CCD automatic positioning, focusing, so that positioning fast, accurate and high accuracy, without manual intervention.

4.操作简单，实现同类型一键式模式，大大提高生产效率。

4. Simple operation, realizing the same type of one-key mode, greatly improving production efficiency.

5.分块、分层、指定块或选择区域切割并直接成型，切割边缘齐整圆顺、光滑无毛刺、无溢胶。

5. Cut into blocks, layers, designated blocks or selected areas and shape directly. Cut edges are smooth, smooth, without burrs and glue spills.

6.产品可以矩阵排列多个进行自动定位切割，特别适合精细、高难度、复杂的图案等外型的切割

6. The product can be arranged in matrix for automatic positioning and cutting, especially for fine, difficult, complex patterns and other shape cutting.

7.废气处理系统：吸风系统可以将切割废气全部消除，避免了对操作人员的危害及对环境的污染。

7. Exhaust gas treatment system: The suction system can eliminate all cutting exhaust gas, avoiding the harm to operators and pollution to the environment.

项目技术参数 ：

Technical parameters of the project:

（一）激光机重量2000KG

(1) Laser machine weight 2000KG

（二）主体尺寸（长*宽*高）1680mm * 1650mm * 1800mm

(2) Main body size (length * width * height) 1680 mm * 1650 mm * 1800 mm

（三）激光器功率10W / 15W（紫外）

(3) Laser power 10W/15W (ultraviolet)

（四）扫描速度1-900毫米/毫秒

(4) Scanning speed 1-900 mm/ms

（五）切割幅面350mm * 400mm / 350mm * 400mm（双平台）

(5) Cutting width 350 mm * 400 mm / 350 mm * 400 mm (double platform)

（六）激光机供应电源AC220V / 3.5KW

(6) Laser power supply AC220V/3.5KW

（七）整机精度±20μm

(7) Accuracy of the whole machine (+20 micron)

（八）切缝宽度20±5μm

(8) The width of the slit is 20+5 um

（九）平台定位精度±2μm

(9) Platform positioning accuracy (+2 micron)

（十）平台重复精度±2μm材料厚度≤1.5mm（视实际材料而定）

(10) Platform repetition accuracy (+2 um) material thickness (<1.5 mm) depending on the actual material.

（十一）激光源紫外激光器

(11) Laser Source Ultraviolet Laser