This machine is used to divide "v" groove substrate, not only greatly improve production efficiency, but also has better guarantee of product quality.
1, the operation is simple, fast, to ensure that the substrate is not due to movement of electronic components and Xun injury.
2, straight knife sliding speed can be manually controlled, V groove guide adjustable height, more quickly applied to different thickness of the substrate.
3, the Depaneling knowledge generated by reducing the internal stress and avoid the tin crack.
4, circular knife can be reused over and over again.
5, the shape of the cutter can be customized.

Machine size 342x378x806mm

The maximum Depaneling length is 350mm
Depaneling speed 0-400mm / s
Depaneling thickness 1.0-3.5mm

Use the voltage manually

Machine weight 40kg