Detailed product description：

Positioning accuracy: ±2μm Repeatability: ±2μm

Focus point diameter: 20±5μm Thickness: ≤1.2Mm
Ambient temperature: 20±2°C Humidity:<60%
Necessary hardware: PC
355nm UV Laser PCB Sub-Board 10W Application for Separating PCBs:

Suitable for cutting objects: FPC board shape, chip cutting, mobile phone camera module.

Cut and form fragments, layers, blocks or selected areas directly. The cutting edge is neat, smooth, smooth and burr-free. Products can be arranged in a matrix for automatic positioning and cutting, especially for fine, difficult, complex patterns and other external cuts

5, high-performance laser: the use of international first-line brand solid-state UV laser, good beam quality, small focal spot, uniform power distribution, small thermal effect, small slit width, high cutting quality, to ensure perfect cutting quality.



355nm UV Laser PCB De-panel Depanelizer, 10W, for separation of PCB characteristics:



1 High Accuracy: The combination of a low drift galvanometer and a fast ironless linear motor system platform enables fast cutting while maintaining micron accuracy.



2 Easy to learn: Independently develop Windows-based control software, easy to use Chinese interface, friendly and beautiful, powerful, diversified, easy to operate.



3.Intelligent automation: High-precision CCD automatic positioning, focusing, positioning is fast and accurate, no manual intervention, simple operation, and the same type of one-button mode is realized, which greatly improves production efficiency. Automatic calibration of the ammeter, auto focus and full automation. Laser displacement sensors are used to automatically adjust the focus to the height of the table for quick alignment and save time and effort.

355nm UV laser PCB panel splitter, 10W, for separation of PCB specifications: