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    Flexible Modular Lead-free Wave Soldering Machine
    Detailed Product Description

    Five Features

    1.Compact structure and small footprint.

    2.PC+PLC control system.

    3.IR preheating, high thermal efficiency and uniform temperature.

    4.Step motor control spraying, more stable and reliable.

    5.Adopts small solder pot, reduces the cost.

     

    Flexible Modular Lead-free Wave Soldering Machine 0

     

    Built-in Spraying Device

     

    Flexible Modular Lead-free Wave Soldering Machine 1

     

    Drawer type module preheating unit

     

    Flexible Modular Lead-free Wave Soldering Machine 2

     

    Linkage inlet buffering

     

    Flexible Modular Lead-free Wave Soldering Machine 3

     

    Solder Pot with Cast iron Material

     

    Flexible Modular Lead-free Wave Soldering Machine 4

     

    1.Conveying system: Direct buffering input structure. Special stainless steel chain transmission, aluminum alloy rail unique design, durable;Conveying system: adopt segmental floating structure, effectively prevent guide rail deformation;

    2.Preheating system: Drawer-type energy-saving design.IR preheating,PID mode temperature control ,the temperature accuracy can reach to ±2℃;the dropping temperature between preheating zone and soldering zone is ≤5℃;

    3.Flux spraying system:Adopt precision control valve for digital regulation, convenient management. Nozzle movement is controlled by stepping motor.Flux automatic pressure supply, can make the spray flow quickly reach saturation, top exhaustin, filtration system;

    4.The solder pot adopts external heating, it is made of cast iron, the inner surface is anticorrosive treatment, with two low-flow nozzle and low oxidation design;

    5.Forced air cooling system;

    6.PC+PLC control system. Windows7 operation system with Chinese/English operation interface. Processing profile and data auto saving function.Alarm for detecting the flux and solder level.

     

    Flexible Modular Lead-free Wave Soldering Machine 5

     

    01 Buffer system

    02 Exhaust fan 

    03 Flux spraying system

    04 Pre-heater  

    05 Solder pot lifting unit  

    06 Dual wave solder pot   

    07 Angle adjustment controller

    08 Cooling system

    09 Finger cleaning system

    10 LCD  

     

    Model No.YSL-300EYSL-320E
    Dimension: L*W*H(mm)3385*1240*15403385*1190*1540
    WeightApprox.1150kgApprox.1100kg
    Power Supply3PH 380V 50HZ3PH 380V 50HZ
    Start up Power28KW27KW
    Normal Running Power7KW6.7KW
    Control SystemPC+PLC
    Spraying movementStep motor
    Spraying Pressure0.2Mpa~0.4Mpa
    Flux Flow ControlOption
    Auto Flux FillingStandard
    ExhaustingTop exhaust/
    Exhausting Pipe Diameter(mm)Φ250
    Exhaust fan power370W/
    Preheating ModeIR
    Temperature Control ModePID
    Preheating Zone Quantity2
    Preheating Zone Length(mm)1500
    Preheating Temperature RangeRoom temperature~200℃
    Warm-up Time(min)Approx.12min(setting: 150℃)
    Width(mm)50~300
    PCB Conveying DirectionL→R( Option:R→L)
    Conveying Speed(mm/min)500~1800
    Conveying Height(mm)750±20
    Available Component Height(mm)Top120 Bottom15
    Conveying Speed Control ModeClosed loop stepless speed regulation by inverter
    FingerSpring Pressing Finger;D-40 Type Finger;Double-hook Finger;Heavy type double hook finger(Options)
    Conveying Angle4~6°
    Solder Pot TypeMechanical
    Solder Pot MaterialCasting Iron material
    Wave Height AdjustmentDigital Control by PC
    Cooling typeAir cooling/
    Solder Pot Heating Power9KW220V 9KW
    Max Solder Pot Temperature300℃
    Solder Pot CapacityApprox.350kg
    Wave Driving Power180W*2 3PH 220 VAC
    Solder Pot Warm-up TimeApprox.150min(setting: 250℃)
    Temperature Control ModePID
    Finger Cleaning SystemBrush/


    Product Categories
                      Flexible Modular Lead-free Wave Soldering Machine
                      Flexible Modular Lead-free Wave Soldering Machine
                      Flexible Modular Lead-free Wave Soldering Machine
                       
                      Detailed Product Description

                      Five Features

                      1.Compact structure and small footprint.

                      2.PC+PLC control system.

                      3.IR preheating, high thermal efficiency and uniform temperature.

                      4.Step motor control spraying, more stable and reliable.

                      5.Adopts small solder pot, reduces the cost.

                       

                      Flexible Modular Lead-free Wave Soldering Machine 0

                       

                      Built-in Spraying Device

                       

                      Flexible Modular Lead-free Wave Soldering Machine 1

                       

                      Drawer type module preheating unit

                       

                      Flexible Modular Lead-free Wave Soldering Machine 2

                       

                      Linkage inlet buffering

                       

                      Flexible Modular Lead-free Wave Soldering Machine 3

                       

                      Solder Pot with Cast iron Material

                       

                      Flexible Modular Lead-free Wave Soldering Machine 4

                       

                      1.Conveying system: Direct buffering input structure. Special stainless steel chain transmission, aluminum alloy rail unique design, durable;Conveying system: adopt segmental floating structure, effectively prevent guide rail deformation;

                      2.Preheating system: Drawer-type energy-saving design.IR preheating,PID mode temperature control ,the temperature accuracy can reach to ±2℃;the dropping temperature between preheating zone and soldering zone is ≤5℃;

                      3.Flux spraying system:Adopt precision control valve for digital regulation, convenient management. Nozzle movement is controlled by stepping motor.Flux automatic pressure supply, can make the spray flow quickly reach saturation, top exhaustin, filtration system;

                      4.The solder pot adopts external heating, it is made of cast iron, the inner surface is anticorrosive treatment, with two low-flow nozzle and low oxidation design;

                      5.Forced air cooling system;

                      6.PC+PLC control system. Windows7 operation system with Chinese/English operation interface. Processing profile and data auto saving function.Alarm for detecting the flux and solder level.

                       

                      Flexible Modular Lead-free Wave Soldering Machine 5

                       

                      01 Buffer system

                      02 Exhaust fan 

                      03 Flux spraying system

                      04 Pre-heater  

                      05 Solder pot lifting unit  

                      06 Dual wave solder pot   

                      07 Angle adjustment controller

                      08 Cooling system

                      09 Finger cleaning system

                      10 LCD  

                       

                      Model No.YSL-300EYSL-320E
                      Dimension: L*W*H(mm)3385*1240*15403385*1190*1540
                      WeightApprox.1150kgApprox.1100kg
                      Power Supply3PH 380V 50HZ3PH 380V 50HZ
                      Start up Power28KW27KW
                      Normal Running Power7KW6.7KW
                      Control SystemPC+PLC
                      Spraying movementStep motor
                      Spraying Pressure0.2Mpa~0.4Mpa
                      Flux Flow ControlOption
                      Auto Flux FillingStandard
                      ExhaustingTop exhaust/
                      Exhausting Pipe Diameter(mm)Φ250
                      Exhaust fan power370W/
                      Preheating ModeIR
                      Temperature Control ModePID
                      Preheating Zone Quantity2
                      Preheating Zone Length(mm)1500
                      Preheating Temperature RangeRoom temperature~200℃
                      Warm-up Time(min)Approx.12min(setting: 150℃)
                      Width(mm)50~300
                      PCB Conveying DirectionL→R( Option:R→L)
                      Conveying Speed(mm/min)500~1800
                      Conveying Height(mm)750±20
                      Available Component Height(mm)Top120 Bottom15
                      Conveying Speed Control ModeClosed loop stepless speed regulation by inverter
                      FingerSpring Pressing Finger;D-40 Type Finger;Double-hook Finger;Heavy type double hook finger(Options)
                      Conveying Angle4~6°
                      Solder Pot TypeMechanical
                      Solder Pot MaterialCasting Iron material
                      Wave Height AdjustmentDigital Control by PC
                      Cooling typeAir cooling/
                      Solder Pot Heating Power9KW220V 9KW
                      Max Solder Pot Temperature300℃
                      Solder Pot CapacityApprox.350kg
                      Wave Driving Power180W*2 3PH 220 VAC
                      Solder Pot Warm-up TimeApprox.150min(setting: 250℃)
                      Temperature Control ModePID
                      Finger Cleaning SystemBrush/


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                      YUSH Electronic Technology Co.,Ltd. Pomeas Optical Technology Copyright 2016
                      CONTACT US
                      Contacts:Eva Liu +86 13416743702
                      Tel:+86-512-62751429
                      Skype:evaliuhuan
                      Email:sales@yushunli.com evaliu@hk-yush.com
                      Company Address:Address: Building H, GuoRui Pioneering
                      Park, No. 1068 Jinyang East Road, Lujia Town, Kunshan,
                      Suzhou,Jiangsu,China.
                      Postcode:215331
                      YUSH Electronic Technology Co.,Ltd. Pomeas Optical Technology Copyright 2016