Features
1.Entirety frame design
2.Multifunctional platform design
3.Visual alignment to ensure the accuracy
4.Integrated transport system
5.Independent cleaning structure
6.Squeegee lifting direct connects with screw rod structure
Overall diagram
1.Rack module
2.Lifting module
3.Platform alignment module
4.Image capture module
5.Stencil frame positioning module
6.Squeegee module
7.Display module
8.Cleaning module
9.Conveyor module
10.Air and power input
11.Housing module
Technical parameters
| Parameter | YSL-T5 | |
| Basic Parameters | Screen Frame Size(mm) | 650(×)×420(Y)-850(×)×850(Y) |
| Thickness∶ 20-40mm | ||
| Min PCB(mm) | 50(×)×50(Y)mm | |
| Max PCB(mm) | 510(X)×510(Y) | |
| Thickness | 0.2mm～6mm( Use jig when pcb less than 0.4mm) | |
| Curve | <1%(Diagonal measurement) | |
| PCB backside Part Height | 20mm | |
| Conveyor height | 900±40mm | |
| Support | Magnetic support,Magnetic piece,Vacuum chamber(Option) | |
| Clamp | Side clamp(Standard),please read the option table | |
| Edge distance | PCB process edge ≥2.5mm | |
| Conveyor speed | 0~1500mm/s,increment 1mm | |
| Conveyor belt | U type sync belt | |
| Stopper method | Air cylinder | |
| Stopper position | Set the PCB stopper position according to the size of board | |
| Flow direction | L-R,R-L,L-L,R-R depends on customer | |
| Print System | Print speed | 5-200mm/sec adjustable |
| Print head | Step motor drive scraper lifting | |
| Scraper | Steel scraper,rubber scraper(option) | |
| Scraper angle | 60° | |
| Scraper pressure | 0~20kg | |
| View System | Substrate Separation | Three-section Substrate Separation；Speed∶0.1-20mm/s；Distance∶0-20mm |
| Alignment position method | Mark Automatic aligning | |
| Camera | Germany BASLER,1/3”CCD,640*480pixel,pixel size 5.6μmx5.6μm | |
| Acquire image method | Upper/under double photo | |
| Camera light | Coaxial light,Ring light four kinds light can adjustable | |
| View range | 9mm*7mm | |
| Mark dimensions | Diameter or Side length 1mm~2mm,allowable offset 10% | |
| Mark shape | Cir,Rec,or rhombus etc | |
| Mark position | PCB dedicated mark or PCB pad | |
| 2D detection | Standard | |
| Accuracy | Table adjusting range | X=±3mm,Y=±7mm,0=±1.5° |
| Positional accuracy | ±0.01mm | |
| Printing accuracy | ±0.025mm | |
| Time | Cycle time | <10s(ex print,cleaning time) |
| Convert line time | <5min | |
| Programming time | <10min | |
| Control System | Computer configuration | Industrial PC,Windows official system |
| System language | Chinese /English | |
| Pre and next machine connection | SMEMA | |
| User authorization | User PW and Senior PW set | |
| Cleaning System | Cleaning system | Dry and Wet(standard),vacuum model(optional) |
| Liquid level detection | Liquid level auto alarm detection | |
| Power Parameters | Main power supply | AC220V±10%50/60HZ Single phase |
| Total power | About 3kw | |
| Main air supply | 4.5～6kgf/cm2 | |
| Machine weight | About 950Kg | |
| Machine dimensions | 1530(L)×1680(W)×1540(H)mm | |
| Option | Pneumatic top clamp | For PCB(thickness≤1mm) |
| Top clamp + side clamp | For PCB(thickness≤1mm) | |
| Vacuum adsorption and clean | For PCB(thickness≤1mm)and FPC | |
| Auto tin added | / | |
| Auto loading and unloading | / | |
| Flexible and universal support | For the Double-sided PCB(PCB backside parts Height ≤9mm) | |
| Automatic positioning of screen frame | Automatic positioning of screen frame | |
| PCB board thickness movement adjustment function | Standard | |
| Squeegee pressure feedback function | / | |
| Air condition | Customer can buy by themselves | |
| The rest of solder paste on the stencil monitoring system | / | |
| SPI close loop | SPI close loop | |
| UPS power off protection | UPS 15 min power off protection | |
| Industry 4.0 | Bar code trace function,Production analysis,etc | |
Features
1.Entirety frame design
2.Multifunctional platform design
3.Visual alignment to ensure the accuracy
4.Integrated transport system
5.Independent cleaning structure
6.Squeegee lifting direct connects with screw rod structure
Overall diagram
1.Rack module
2.Lifting module
3.Platform alignment module
4.Image capture module
5.Stencil frame positioning module
6.Squeegee module
7.Display module
8.Cleaning module
9.Conveyor module
10.Air and power input
11.Housing module
Technical parameters
| Parameter | YSL-T5 | |
| Basic Parameters | Screen Frame Size(mm) | 650(×)×420(Y)-850(×)×850(Y) |
| Thickness∶ 20-40mm | ||
| Min PCB(mm) | 50(×)×50(Y)mm | |
| Max PCB(mm) | 510(X)×510(Y) | |
| Thickness | 0.2mm～6mm( Use jig when pcb less than 0.4mm) | |
| Curve | <1%(Diagonal measurement) | |
| PCB backside Part Height | 20mm | |
| Conveyor height | 900±40mm | |
| Support | Magnetic support,Magnetic piece,Vacuum chamber(Option) | |
| Clamp | Side clamp(Standard),please read the option table | |
| Edge distance | PCB process edge ≥2.5mm | |
| Conveyor speed | 0~1500mm/s,increment 1mm | |
| Conveyor belt | U type sync belt | |
| Stopper method | Air cylinder | |
| Stopper position | Set the PCB stopper position according to the size of board | |
| Flow direction | L-R,R-L,L-L,R-R depends on customer | |
| Print System | Print speed | 5-200mm/sec adjustable |
| Print head | Step motor drive scraper lifting | |
| Scraper | Steel scraper,rubber scraper(option) | |
| Scraper angle | 60° | |
| Scraper pressure | 0~20kg | |
| View System | Substrate Separation | Three-section Substrate Separation；Speed∶0.1-20mm/s；Distance∶0-20mm |
| Alignment position method | Mark Automatic aligning | |
| Camera | Germany BASLER,1/3”CCD,640*480pixel,pixel size 5.6μmx5.6μm | |
| Acquire image method | Upper/under double photo | |
| Camera light | Coaxial light,Ring light four kinds light can adjustable | |
| View range | 9mm*7mm | |
| Mark dimensions | Diameter or Side length 1mm~2mm,allowable offset 10% | |
| Mark shape | Cir,Rec,or rhombus etc | |
| Mark position | PCB dedicated mark or PCB pad | |
| 2D detection | Standard | |
| Accuracy | Table adjusting range | X=±3mm,Y=±7mm,0=±1.5° |
| Positional accuracy | ±0.01mm | |
| Printing accuracy | ±0.025mm | |
| Time | Cycle time | <10s(ex print,cleaning time) |
| Convert line time | <5min | |
| Programming time | <10min | |
| Control System | Computer configuration | Industrial PC,Windows official system |
| System language | Chinese /English | |
| Pre and next machine connection | SMEMA | |
| User authorization | User PW and Senior PW set | |
| Cleaning System | Cleaning system | Dry and Wet(standard),vacuum model(optional) |
| Liquid level detection | Liquid level auto alarm detection | |
| Power Parameters | Main power supply | AC220V±10%50/60HZ Single phase |
| Total power | About 3kw | |
| Main air supply | 4.5～6kgf/cm2 | |
| Machine weight | About 950Kg | |
| Machine dimensions | 1530(L)×1680(W)×1540(H)mm | |
| Option | Pneumatic top clamp | For PCB(thickness≤1mm) |
| Top clamp + side clamp | For PCB(thickness≤1mm) | |
| Vacuum adsorption and clean | For PCB(thickness≤1mm)and FPC | |
| Auto tin added | / | |
| Auto loading and unloading | / | |
| Flexible and universal support | For the Double-sided PCB(PCB backside parts Height ≤9mm) | |
| Automatic positioning of screen frame | Automatic positioning of screen frame | |
| PCB board thickness movement adjustment function | Standard | |
| Squeegee pressure feedback function | / | |
| Air condition | Customer can buy by themselves | |
| The rest of solder paste on the stencil monitoring system | / | |
| SPI close loop | SPI close loop | |
| UPS power off protection | UPS 15 min power off protection | |
| Industry 4.0 | Bar code trace function,Production analysis,etc | |
