YSL-k870 meets 870*610mm printing process requirements
1.Image and optical system
Using uniform ring light and high brightness coaxial light,with promise brightness adjustment function,then all types of Mark points can be well recognized (Including the rugged Mark points),applicable for tin plating,coppering,gold plating,tin spraying,FPC and other types PCB with of different colors.With YUSH patent mathematical model,able to ensure high accuracy.
2.Cleaning system
YUSH cleaning system equipped with three cleaning methods: dry cleaning, wet cleaning. vacuum.which can be combined to use.It can also be cleaned by manual if customer do not need to use automatic cleaning to reduce the cleaning time and improve production efficiency. The newly wiping system ensures full contact with the stencil, increased vacuum suction can effectively eliminate the remaining paste in the mesh,which can achieve effective automatic cleaning function. CCD part and cleaning system is separated, when CCD working. CCD part independently move to reduce the servo motor load and improve the machine speed and accuracy.
3.Adjustable Stepping Motor-Programmable &Floating Print-Heads
4.Chinese/English Operating Interface
The machine adopts windows XP/win7 operating interface with YUSH user friendly software.Chinese/English selectable,Menu/Operating Journal/Breakdown Record/Breakdown Diagnosis/Error Analysis/Light Alarm etc
5.YUSH special adjustment jacking platform.
Stable and easy to adjust,it can quickly adjust the pin jacking height of PCB with different thickness.
6.2D Solder Paste Print Quality Inspection and Analysis System
The 2D system immediately detects solder paste deposition defects such as deviation, lack paste,miss paste,paste joint etc,and guarantees print quality.
Specifications | |
Machine Performance | |
Repeat Position Accuracy | ±0.01mm |
Print Accuracy | ±0.025mm |
NCP-CT (excluding cleaning and printing) | <10.5 sec |
HCP-CT (including cleaning and printing) | 25s/pcs |
Process CT | 6min |
Transversal CT | 4min |
Substrate processing parameter | |
Maximum board size | 870*610mm |
Minimum board size | 100*65mm |
Board thickness | 0.4~8mm |
Camera Mechanical range | 870*610mm |
Maximum board weight | 10kg |
Board edge clearance | 3.5mm |
Board height | 23mm beyond the special top pin |
Transport speed | 900+40mm |
(Max)Transport speed | Segment control,1500mm/s(Max) |
Transport direction | One stage transport rail |
Transmission direction | Left to right |
Right to Left | |
In and out the same | |
Support System | Magnetic Pin |
(65mm)Support Block | |
(65mm)Patented over the top clamping | |
Board clamp | Automatic to clamping |
Side clamping | |
Adsorption function | |
Printing Parameters | |
Print Speed | 10~150mm/sec |
Print Pressure | 0.5~30Kg |
Print Mode | Single or double scraper printing |
Queegee Type | Rubber/Squeegee Blade (angle45/55/60) |
Snap-off | 0~20mm |
Snap-Speed | 0~20mm/sec |
The template frame size | 650*550mm~1100*950mm |
Steel mesh positioning mode | Automatic Y orientation (compatible with manual compensation adjustment) |
Cleaning Parameters | |
Cleaning System | Dry，Wet Vacuum three modes |
High speed cleaning | weave cleaning |
Cleaning system | Top drip |
Cleaning stroke | Automatic generation |
Cleaning position | Post cleaning |
Cleaning Speed | 10-200mm/sec |
Cleaning fluid consumption | Auto&Manually adjustable |
Cleaning paper consumption | Auto&Manually adjustable |
Vision Parameters | |
CCD FOV | 10*8mm |
Camera type | 130 Thousand CCD Digital camera |
Camera System | Lock up/down optics structure |
Camera Cycle time | 200 ms |
Fiducial mark types | Standard Fiducial Mark Shape |
round、square、diamond、cross | |
Pad and profile | |
Mark size | 0.1-6mm |
Mark number | Max: 4pCs |
Stay away number | Max: 1pcs |
Machine parameter | |
Power Source | AC:220±10%，50/60Hz 3KW |
Air Pressure | 4~6Kgf/cm2 |
Air Consumption | About 5L/min |
Operating Temperature | -20℃~+45℃ |
Working environment humidity | 30%~60% |
Machine dimension(without Tower light) | 1530(H)mm |
Machine Length | 1590(L) mm |
Machine Width | 1608(W)mm |
Machine Weight Approx | Approx:1500Kg |
Equipment load bearing requirements | 650Kg/㎡ |
The information contained in this manual contains general descriptions and performance characteristics that may be inconsistent with the product described.or may change with the development of technology.Specific performance characteristics and functions are binding only when an agreement is reached.
Dimensional appearance
YSL-k870 meets 870*610mm printing process requirements
1.Image and optical system
Using uniform ring light and high brightness coaxial light,with promise brightness adjustment function,then all types of Mark points can be well recognized (Including the rugged Mark points),applicable for tin plating,coppering,gold plating,tin spraying,FPC and other types PCB with of different colors.With YUSH patent mathematical model,able to ensure high accuracy.
2.Cleaning system
YUSH cleaning system equipped with three cleaning methods: dry cleaning, wet cleaning. vacuum.which can be combined to use.It can also be cleaned by manual if customer do not need to use automatic cleaning to reduce the cleaning time and improve production efficiency. The newly wiping system ensures full contact with the stencil, increased vacuum suction can effectively eliminate the remaining paste in the mesh,which can achieve effective automatic cleaning function. CCD part and cleaning system is separated, when CCD working. CCD part independently move to reduce the servo motor load and improve the machine speed and accuracy.
3.Adjustable Stepping Motor-Programmable &Floating Print-Heads
4.Chinese/English Operating Interface
The machine adopts windows XP/win7 operating interface with YUSH user friendly software.Chinese/English selectable,Menu/Operating Journal/Breakdown Record/Breakdown Diagnosis/Error Analysis/Light Alarm etc
5.YUSH special adjustment jacking platform.
Stable and easy to adjust,it can quickly adjust the pin jacking height of PCB with different thickness.
6.2D Solder Paste Print Quality Inspection and Analysis System
The 2D system immediately detects solder paste deposition defects such as deviation, lack paste,miss paste,paste joint etc,and guarantees print quality.
Specifications | |
Machine Performance | |
Repeat Position Accuracy | ±0.01mm |
Print Accuracy | ±0.025mm |
NCP-CT (excluding cleaning and printing) | <10.5 sec |
HCP-CT (including cleaning and printing) | 25s/pcs |
Process CT | 6min |
Transversal CT | 4min |
Substrate processing parameter | |
Maximum board size | 870*610mm |
Minimum board size | 100*65mm |
Board thickness | 0.4~8mm |
Camera Mechanical range | 870*610mm |
Maximum board weight | 10kg |
Board edge clearance | 3.5mm |
Board height | 23mm beyond the special top pin |
Transport speed | 900+40mm |
(Max)Transport speed | Segment control,1500mm/s(Max) |
Transport direction | One stage transport rail |
Transmission direction | Left to right |
Right to Left | |
In and out the same | |
Support System | Magnetic Pin |
(65mm)Support Block | |
(65mm)Patented over the top clamping | |
Board clamp | Automatic to clamping |
Side clamping | |
Adsorption function | |
Printing Parameters | |
Print Speed | 10~150mm/sec |
Print Pressure | 0.5~30Kg |
Print Mode | Single or double scraper printing |
Queegee Type | Rubber/Squeegee Blade (angle45/55/60) |
Snap-off | 0~20mm |
Snap-Speed | 0~20mm/sec |
The template frame size | 650*550mm~1100*950mm |
Steel mesh positioning mode | Automatic Y orientation (compatible with manual compensation adjustment) |
Cleaning Parameters | |
Cleaning System | Dry，Wet Vacuum three modes |
High speed cleaning | weave cleaning |
Cleaning system | Top drip |
Cleaning stroke | Automatic generation |
Cleaning position | Post cleaning |
Cleaning Speed | 10-200mm/sec |
Cleaning fluid consumption | Auto&Manually adjustable |
Cleaning paper consumption | Auto&Manually adjustable |
Vision Parameters | |
CCD FOV | 10*8mm |
Camera type | 130 Thousand CCD Digital camera |
Camera System | Lock up/down optics structure |
Camera Cycle time | 200 ms |
Fiducial mark types | Standard Fiducial Mark Shape |
round、square、diamond、cross | |
Pad and profile | |
Mark size | 0.1-6mm |
Mark number | Max: 4pCs |
Stay away number | Max: 1pcs |
Machine parameter | |
Power Source | AC:220±10%，50/60Hz 3KW |
Air Pressure | 4~6Kgf/cm2 |
Air Consumption | About 5L/min |
Operating Temperature | -20℃~+45℃ |
Working environment humidity | 30%~60% |
Machine dimension(without Tower light) | 1530(H)mm |
Machine Length | 1590(L) mm |
Machine Width | 1608(W)mm |
Machine Weight Approx | Approx:1500Kg |
Equipment load bearing requirements | 650Kg/㎡ |
The information contained in this manual contains general descriptions and performance characteristics that may be inconsistent with the product described.or may change with the development of technology.Specific performance characteristics and functions are binding only when an agreement is reached.
Dimensional appearance
