High Quality Desktop selective wave soldering YS-E320 For SMT Production LIine
Discription:
Specification items | YS-E320 |
Applicable PCB board size | L*W : 50×50~450×400 mm |
Applicable PCB board thickness | Substrate thickness:0.8~3 mm / Pin length:Within 3mm |
Component height | Less than 100mm above the substrate / Less than 50mm below the substrate |
Substrate shape and conditions | 1.Substrate placement edge:The edge of the substrate process is more than 3mm 2The weight including components is less than 5 kilograms 3.The bending of the substrate: less than 0.5mm |
Tin furnace | Tin furnace material/capacity:Stainless steel material / 10KG tin tank capacity:Power:4*500W 2 KW |
N2 Requirements | Nitrogen purity:99.999% Pressure/Consumption:0.5MPa / 20ℓ/min~30ℓ/min / 1.2-1.5Cube H |
Flux nozzle | Precisi n fluid nozzle |
Flux capacity | 2 L (Manual liquid addition) |
Gas source | 0.5-0.7Mpa |
Nozzle inner diameter | φ 3mm~φ 20mm Customizable size |
Peak height | Automatic alignment/height measurement |
System control | PC+PLC(windows+Huichuan) |
Programming software | Support programming for drawing lines on pictures(Convenient and fast) |
Power supply/power | Single-phase 220V±10% Starting power:2.5KW |
Weight | 70KG (Containing solder10KG) |
External dimensions | L*W*H 730×800×840 mm |
Selective spraying
Fogging effect (shot in strong light) Linear spray (optional)
Original 0.5mm "Lumina" imported from Japan
Precision fluid nozzle
Selective spraying
Advantage
Sealed system - no evaporation
It can maintain the original packaging performance of the flux
The dosage is controllable and repeatable
The dosage is very low. Strong process reliability
No solvent needs to be added The flux was fully utilized and there was no waste
Preheat the top of the PCB board
Preheat the top of the PCB board(Optional)
A 1KW infrared heating tube is adopted to preheat the PCB board before soldering,
which meets the high temperature requirements of special components, reduces the thermal
shock of components, activates the activity of flux, improves the tin penetration
of component pins, and enhances the soldering quality
Preheat the bottom of the PCB board
Preheating the bottom of the PCB board
Taking advantage of the fast heat conduction speed of infrared rays, the PCB board is preheated before soldering and maintained
at the set frequency during soldering to prevent temperature drop of the PCB board during soldering.
It belongs to the design principle of "preheating + soldering" carried out simultaneously, which improves the soldering efficiency and the tin penetration
rate of components, and reduces the thermal shock caused by the sudden heat of heat-sensitive components. The cleanliness ratio of the PCB board after soldering is relatively high.
Consumables - nozzles
The nozzle can be selected according to the size of the weld point
The solder penetration rate and soldering time of each solder joint can be controlled
The nozzle size is as follows*
Outer diameter 4 ,6, 8, 10, 12, 14mm, + Special customization
The nozzle size is made in increments of 2mm by default,
but nozzles and special-shaped nozzles can be customized
according to actual needs.
If you need any other sizes, please contact Xinrui
*The nozzle size is derived from the diameter of the nozzle's external contour
High Quality Desktop selective wave soldering YS-E320 For SMT Production LIine
Discription:
Specification items | YS-E320 |
Applicable PCB board size | L*W : 50×50~450×400 mm |
Applicable PCB board thickness | Substrate thickness:0.8~3 mm / Pin length:Within 3mm |
Component height | Less than 100mm above the substrate / Less than 50mm below the substrate |
Substrate shape and conditions | 1.Substrate placement edge:The edge of the substrate process is more than 3mm 2The weight including components is less than 5 kilograms 3.The bending of the substrate: less than 0.5mm |
Tin furnace | Tin furnace material/capacity:Stainless steel material / 10KG tin tank capacity:Power:4*500W 2 KW |
N2 Requirements | Nitrogen purity:99.999% Pressure/Consumption:0.5MPa / 20ℓ/min~30ℓ/min / 1.2-1.5Cube H |
Flux nozzle | Precisi n fluid nozzle |
Flux capacity | 2 L (Manual liquid addition) |
Gas source | 0.5-0.7Mpa |
Nozzle inner diameter | φ 3mm~φ 20mm Customizable size |
Peak height | Automatic alignment/height measurement |
System control | PC+PLC(windows+Huichuan) |
Programming software | Support programming for drawing lines on pictures(Convenient and fast) |
Power supply/power | Single-phase 220V±10% Starting power:2.5KW |
Weight | 70KG (Containing solder10KG) |
External dimensions | L*W*H 730×800×840 mm |
Selective spraying
Fogging effect (shot in strong light) Linear spray (optional)
Original 0.5mm "Lumina" imported from Japan
Precision fluid nozzle
Selective spraying
Advantage
Sealed system - no evaporation
It can maintain the original packaging performance of the flux
The dosage is controllable and repeatable
The dosage is very low. Strong process reliability
No solvent needs to be added The flux was fully utilized and there was no waste
Preheat the top of the PCB board
Preheat the top of the PCB board(Optional)
A 1KW infrared heating tube is adopted to preheat the PCB board before soldering,
which meets the high temperature requirements of special components, reduces the thermal
shock of components, activates the activity of flux, improves the tin penetration
of component pins, and enhances the soldering quality
Preheat the bottom of the PCB board
Preheating the bottom of the PCB board
Taking advantage of the fast heat conduction speed of infrared rays, the PCB board is preheated before soldering and maintained
at the set frequency during soldering to prevent temperature drop of the PCB board during soldering.
It belongs to the design principle of "preheating + soldering" carried out simultaneously, which improves the soldering efficiency and the tin penetration
rate of components, and reduces the thermal shock caused by the sudden heat of heat-sensitive components. The cleanliness ratio of the PCB board after soldering is relatively high.
Consumables - nozzles
The nozzle can be selected according to the size of the weld point
The solder penetration rate and soldering time of each solder joint can be controlled
The nozzle size is as follows*
Outer diameter 4 ,6, 8, 10, 12, 14mm, + Special customization
The nozzle size is made in increments of 2mm by default,
but nozzles and special-shaped nozzles can be customized
according to actual needs.
If you need any other sizes, please contact Xinrui
*The nozzle size is derived from the diameter of the nozzle's external contour
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