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Laser PCB board splitter 10W for separating 355nm UV of PCB
Detailed product description：

Positioning accuracy: ±2μm Repeatability: ±2μm

Focus point diameter: 20±5μm Thickness: ≤1.2Mm
Ambient temperature: 20±2°C Humidity: <60%
Necessary hardware: PC
355nm UV Laser PCB Sub-Board 10W Application for Separating PCBs:



Suitable for cutting objects: FPC board shape, chip cutting, mobile phone camera module.

Cut and form fragments, layers, blocks or selected areas directly. The cutting edge is neat, smooth, smooth and burr-free. Products can be arranged in a matrix for automatic positioning and cutting, especially for fine, difficult, complex patterns and other external cuts

5, high-performance laser: the use of international first-line brand solid-state UV laser, good beam quality, small focal spot, uniform power distribution, small thermal effect, small slit width, high cutting quality, to ensure perfect cutting quality.



355nm UV Laser PCB De-panel Depanelizer, 10W, for separation of PCB characteristics:



1 High Accuracy: The combination of a low drift galvanometer and a fast ironless linear motor system platform enables fast cutting while maintaining micron accuracy.



2 Easy to learn: Independently develop Windows-based control software, easy to use Chinese interface, friendly and beautiful, powerful, diversified, easy to operate.



3Intelligent automation: High-precision CCD automatic positioning, focusing, positioning is fast and accurate, no manual intervention, simple operation, and the same type of one-button mode is realized, which greatly improves production efficiency. Automatic calibration of the ammeter, auto focus and full automation. Laser displacement sensors are used to automatically adjust the focus to the height of the table for quick alignment and save time and effort.



355nm UV laser PCB panel splitter, 10W, for separation of PCB specifications:


Size (L*W*H) 1250mm*1300mm*1600mm
Weight 1500Kg
Laser power supply AC220V / 3KW
Laser Sources All Solid State 355nm UV Lasers
Laser power 10W (customer-made or imported according to customer requirements)
Thickness ≤ 1.2 mm (depending on actual material)
Machine accuracy ±20 μm
Platform positioning accuracy ±2 μm
Platform repeat ability ±2 μm
Cutting web Double Y table, single Y area 300*330mm
Focus spot diameter 20±5μm
Ambient temperature/humidity 20±2 °C/<60 %
Machine Tool Body Galvo mirror system imported
Motion System Full-closed AC linear motor system
Motion Control System Original Import
Necessary hardware &software Including PC and CAM software
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                            Laser PCB board splitter 10W for separating 355nm UV of PCB

                            Detailed product description：

                            Positioning accuracy: ±2μm Repeatability: ±2μm

                            Focus point diameter: 20±5μm Thickness: ≤1.2Mm
                            Ambient temperature: 20±2°C Humidity: <60%
                            Necessary hardware: PC
                            355nm UV Laser PCB Sub-Board 10W Application for Separating PCBs:



                            Suitable for cutting objects: FPC board shape, chip cutting, mobile phone camera module.

                            Cut and form fragments, layers, blocks or selected areas directly. The cutting edge is neat, smooth, smooth and burr-free. Products can be arranged in a matrix for automatic positioning and cutting, especially for fine, difficult, complex patterns and other external cuts

                            5, high-performance laser: the use of international first-line brand solid-state UV laser, good beam quality, small focal spot, uniform power distribution, small thermal effect, small slit width, high cutting quality, to ensure perfect cutting quality.



                            355nm UV Laser PCB De-panel Depanelizer, 10W, for separation of PCB characteristics:



                            1 High Accuracy: The combination of a low drift galvanometer and a fast ironless linear motor system platform enables fast cutting while maintaining micron accuracy.



                            2 Easy to learn: Independently develop Windows-based control software, easy to use Chinese interface, friendly and beautiful, powerful, diversified, easy to operate.



                            3Intelligent automation: High-precision CCD automatic positioning, focusing, positioning is fast and accurate, no manual intervention, simple operation, and the same type of one-button mode is realized, which greatly improves production efficiency. Automatic calibration of the ammeter, auto focus and full automation. Laser displacement sensors are used to automatically adjust the focus to the height of the table for quick alignment and save time and effort.



                            355nm UV laser PCB panel splitter, 10W, for separation of PCB specifications:


                            Size (L*W*H) 1250mm*1300mm*1600mm
                            Weight 1500Kg
                            Laser power supply AC220V / 3KW
                            Laser Sources All Solid State 355nm UV Lasers
                            Laser power 10W (customer-made or imported according to customer requirements)
                            Thickness ≤ 1.2 mm (depending on actual material)
                            Machine accuracy ±20 μm
                            Platform positioning accuracy ±2 μm
                            Platform repeat ability ±2 μm
                            Cutting web Double Y table, single Y area 300*330mm
                            Focus spot diameter 20±5μm
                            Ambient temperature/humidity 20±2 °C/<60 %
                            Machine Tool Body Galvo mirror system imported
                            Motion System Full-closed AC linear motor system
                            Motion Control System Original Import
                            Necessary hardware &software Including PC and CAM software
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