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SMT wave soldering machine
Selective-Soldering-System-C
samtronik

Selective Soldering System-C

Specification
MODEL
YSCPS 4/25 One module
YSCPS 4/35 Two modules
Equipment parameters
Dimension(L×W×H)
2700x1735x1415 (mm)
2700x1735x1415 (mm)
Transport Parameters
PCB size
L330*W250 (mm)
L400*W350 (mm)
Conveyor height
900±20(mm)
The soldering system
Solder pot
electromagnetic pump tin solder pot
The amount of tin dross
0.5KG/pot/week x2
0.5KG/pot/week x4
Nitrogen consumption
1.5-2m³/h/potx1
solder pot numbers
single pot

Specifications:
Flux module x axis distance (max.)
510mm
Flux module y axis distance (max.)
450mm
Max. nozzle speed
7m/min
Flux content
2 L
Flux type
RO, RE and OR and with the effective standard of L0, L1, M0, according to IEC 61190-1-1
Flux effective level
L0, L1, M0
Nozzle
130 μm, alternative diameter
Spray pressure
0.5~1.0 bar
Spray width
2~8 mm (with spray nozzle 130 μm)
Spray speed
20 mm/s
Positioning speed
400 mm/s
Positioning accuracy
±0.2 mm
Flux system
2-axis With Servo Drive

PREHEATING MODULE

Introduction:
The current selective soldering processes, in particular those for lead-free soldering,
multi-layer boards or high mass components, call for increased preheat capacities.
Short wave IR heater on the bottom and hot air convective preheating on the top, to
ensure preheating evenly.
Features:
1, Segmented & modular layout, preheating more flexibly.
2, Lower short wave IR preheating on the bottom,increasing the efficiency.
3, Hot air convection preheating on the top, preheating more evenly (optional).

Specifications:
Top heater power
4KW
Top heater voltage
220V
Bottom heater powerr
4.8KW
Bottom heater voltage
220V
CDA pressure
0.5-0.7MPa
SOLDERING MODULE

Advantages Of Using Induction Pump:
1,3-axis servo drives, high control precision.
2,Min.nozzle diameter is 3mm,point or track soldering available according to different through hole components.
3,Max.solder wave height is 5mm and controllable,soldering climb rate increased largely.
4,Dual-pot optional, highest flexible.
5,Nitrogen protection, only minute amounts of dross.
6,Pot temperature are continuously monitored.
7,Wave height monitoring available.
8,Solder level monitoring available.
9,No mechanical movement and no wearing.

Specifications:
Solder nozzle position
Middle
Solder content
13 Kg
Max. soldering temperature
350 °C
Min. internal diameter of solder nozzle
3 mm, External Diameter 4.5 mm
Max. Solder wave height
5 mm
Soldering speed X,Y-axis
10 mm/s
Positioning speed X,Y-axis
200 mm/s
Positioning speed Z-axis
100 mm/s
Positioning accuracy
±0.15 mm
Max.solder distance(x axis)
510mm
Max.solder distance(y axis)
460mm
Max.distance of z-axis
58mm
Max.pot moving speed
5.8m/min
Control system
3-axis With Servo Drive
Product Categories

                Selective-Soldering-System-C


                samtronik

                Selective Soldering System-C

                Specification
                MODEL
                YSCPS 4/25 One module
                YSCPS 4/35 Two modules
                Equipment parameters
                Dimension(L×W×H)
                2700x1735x1415 (mm)
                2700x1735x1415 (mm)
                Transport Parameters
                PCB size
                L330*W250 (mm)
                L400*W350 (mm)
                Conveyor height
                900±20(mm)
                The soldering system
                Solder pot
                electromagnetic pump tin solder pot
                The amount of tin dross
                0.5KG/pot/week x2
                0.5KG/pot/week x4
                Nitrogen consumption
                1.5-2m³/h/potx1
                solder pot numbers
                single pot

                Specifications:
                Flux module x axis distance (max.)
                510mm
                Flux module y axis distance (max.)
                450mm
                Max. nozzle speed
                7m/min
                Flux content
                2 L
                Flux type
                RO, RE and OR and with the effective standard of L0, L1, M0, according to IEC 61190-1-1
                Flux effective level
                L0, L1, M0
                Nozzle
                130 μm, alternative diameter
                Spray pressure
                0.5~1.0 bar
                Spray width
                2~8 mm (with spray nozzle 130 μm)
                Spray speed
                20 mm/s
                Positioning speed
                400 mm/s
                Positioning accuracy
                ±0.2 mm
                Flux system
                2-axis With Servo Drive

                PREHEATING MODULE

                Introduction:
                The current selective soldering processes, in particular those for lead-free soldering,
                multi-layer boards or high mass components, call for increased preheat capacities.
                Short wave IR heater on the bottom and hot air convective preheating on the top, to
                ensure preheating evenly.
                Features:
                1, Segmented & modular layout, preheating more flexibly.
                2, Lower short wave IR preheating on the bottom,increasing the efficiency.
                3, Hot air convection preheating on the top, preheating more evenly (optional).

                Specifications:
                Top heater power
                4KW
                Top heater voltage
                220V
                Bottom heater powerr
                4.8KW
                Bottom heater voltage
                220V
                CDA pressure
                0.5-0.7MPa
                SOLDERING MODULE

                Advantages Of Using Induction Pump:
                1,3-axis servo drives, high control precision.
                2,Min.nozzle diameter is 3mm,point or track soldering available according to different through hole components.
                3,Max.solder wave height is 5mm and controllable,soldering climb rate increased largely.
                4,Dual-pot optional, highest flexible.
                5,Nitrogen protection, only minute amounts of dross.
                6,Pot temperature are continuously monitored.
                7,Wave height monitoring available.
                8,Solder level monitoring available.
                9,No mechanical movement and no wearing.

                Specifications:
                Solder nozzle position
                Middle
                Solder content
                13 Kg
                Max. soldering temperature
                350 °C
                Min. internal diameter of solder nozzle
                3 mm, External Diameter 4.5 mm
                Max. Solder wave height
                5 mm
                Soldering speed X,Y-axis
                10 mm/s
                Positioning speed X,Y-axis
                200 mm/s
                Positioning speed Z-axis
                100 mm/s
                Positioning accuracy
                ±0.15 mm
                Max.solder distance(x axis)
                510mm
                Max.solder distance(y axis)
                460mm
                Max.distance of z-axis
                58mm
                Max.pot moving speed
                5.8m/min
                Control system
                3-axis With Servo Drive
                YUSH Electronic Technology Co.,Ltd. Pomeas Optical Technology Copyright 2016
                CONTACT US
                Contacts:Eva Liu +86 13416743702
                Tel:+86-512-62751429
                Skype:evaliuhuan
                Email:sales@yushunli.com evaliu@hk-yush.com
                Company Address:Address: Building H, GuoRui Pioneering
                Park, No. 1068 Jinyang East Road, Lujia Town, Kunshan,
                Suzhou,Jiangsu,China.
                Postcode:215331
                YUSH Electronic Technology Co.,Ltd. Pomeas Optical Technology Copyright 2016